ESPROS Photonics Corporation (short "epc") will become a leading manufacturer of photonics chips for industrial applications. The capabilities include state-of-the-art photo detector devices in the visible and near infrared range combined with mixed signal CMOS circuitry on the same chip. Photo detector capabilities are PIN diodes as well as buried channel CCD devices. Needless to say, that CMOS camera chips with integrated image processing and recognition capabilities are also on the product list.

epc’s capabilities are front-end and back-end processes including specialized packaging for photonics chips. The fab processes 8 inch wafers in the 180 nm node.

epc was founded in October 2006 by private investors and is in the stage of being set-up. Currently epc is working on the process characteristics and on the fab layout. It is planned to build the factory in the eastern part of Switzerland in 2008. An already established chip design center is located in Baar/ZG, in central Switzerland, just 20 minutes by public transportation from Zurich. When construction work within the Gonzen mountain in Sargans is completed, epc will begin production. Click here to see the construction site.

Contacts

Fab (How to get there)	Design (How to get there)
ESPROS Photonics AG	ESPROS Photonics AG
Ragazerstrasse 61	Lindenstrasse 10
CH-7320 Sargans	CH-6340 Baar
Switzerland	Switzerland
Phone +41 58 411 0300	Phone +41 58 411 0400
Fax +41 58 411 0301	Fax +41 58 411 0401
info@espros.ch