Foundry Services

For partners with their own design capability, ESPROS photonics offers foundry services based on our proprietary ESPROS Photonic CMOS® process  We can offer support to you in every aspect of the development process from idea to a product ready to sell. Especially when it comes to the delicate integration of the photonic front-end (e.g. Photodiodes, active pixels, CCD structures etc.), the deep technical understanding of the process is mandatory in order to achieve excellent results.

Features

  • 150nm CMOS process
  • CCD trench 90nm
  • Wafer size 8"
  • Backside processing including thinning, backside contact, AR coating, diffractive filter
  • Mask size 21 x 25 mm
  • Multi-layer masks (4 and 9 masks per reticle)
  • Fast process run 10-14 weeks
  • Flexible process start options
  • MPW possible

Packaging Services Upon Request

  • Testing
  • Dicing
  • Packaging (CSP, QFN, prototyping)
  • Die sort
  • Tape on reel