Packaging Technologies
ESPROS Photonics delivers products in two of the most advanced and cost-effective packaging technologies. Our IC's are available either in a Quad Flat No-Lead (QFN) or Wafer Level Chip Scale Package (WLCSP). Both packages are RoHS compliant and can easily be assembled with standard SMT assembly equipment. The components come in a 7 inch or 13 inch tape on reel package.
| Product family | QFN Package | WLCSP Package |
|---|---|---|
| epc1xx | yes | yes |
| epc13x | yes | yes |
| epc3xx | n/a | yes |
| epc60x | n/a | yes |
| epc70x | yes | yes |
Beside these standard packages there are various optical packages under development. Please contact our sales office for further information.
Reliability of the packages is qualified according to the stress tests defined by the following JEDEC Standards:
| Reliability Stress Test | Abbreviation | JDEC Standard |
|---|---|---|
| Moisture Senisitivity Level | MSL | JECEC JSTD020D-01 |
| Temperature Cycling Test | TCT | JECEC JESD22-A104 |
| Highly Accelerated Stress Test | HAST | JECEC JESD22-A118 |
| Temperature / Humidity Test | THT | JECEC JESD22-A101 |
| High Temperature Storage Test | HTST | JECEC JESD22-A103 |
Quad Flat No-Lead Package (QFN)
The Quad Flat No-Lead (QFN) package is a plastic encapsulated package with a copper leadframe substrate. Instead of leads perimeter lands on the bottom of the package provide electrical contact to the printed circuit board. The die is attached on a paddle which is exposed on the bottom surface of the package to allow an efficient heat transfer when the exposed pad is soldered directly to the printed circuit board. The small size and weight of the QFN package along with the excellent electrical and thermal performance make this package an ideal choice for applications wherever space is limited such as applications in handheld portable devices, in light barriers or in 3D-time-of-flight cameras. The QFN packages are RoHS compliant and can be easily assembled with standard SMT assembly equipment.
| Product Family | QFN Package | Tape (mm) | Reel (inch) | Package Quantity | ||
| Body Size (mm) | Leads | Pitch (mm) | ||||
| epc10x | 3x3 | 16 | 0.5 | 12 | 13 | 3000 |
| epc11x | 3x3 | 16 | 0.5 | 12 | 13 | 2000 |
| epc13x | 3x3 | 16 | 0.5 | 12 | 13 | 3000 |
| epc70x | 3x3 | 16 | 0.5 | 12 | 13 | 5000 |
Typical electrical and thermal performance of QFN packages
| QFN Package | Inductance | Capacitance | Resistance | Thermal Resistance | ||
|---|---|---|---|---|---|---|
| Body Size (mm) | Leads | Pitch (mm) | (nH) | (pF) | (mOhm) | (°C/W) |
| 3x3 | 16 | 0.5 | 0.5 | 0.2 | 140 | 60 |
Wafer Level Chip Scale Package (WLCSP)
The Wafer Level Chip Scale Package (WLCSP) is the ultimate package in terms of package size and cost. All WLCS-Packages are RoHS compliant. The attached solder bumps are made up of a lead free alloy. The components are packaged in a 7 inch or 13 inch tape and reel package. Hence, the components can easily be flip chip mounted with standard SMT assembly equipment.
Photo Diode epc310 in CSP package on PCB
Optical Packages
We offer optical packages for imager IC's. Please contact us with your requirements.
